Micross AIT is looking to immediately hire an MS or PhD candidate student with thin film deposition and/or wafer processing experience for a 6 month internship, ideally 20-25 hrs/week. The work schedule is flexible so the student can honor his/her commitments for obtaining his/her degree. The current position is funded from January – June 2019, with an option to extend through the end of the summer. (Please note, student must be a US citizen or permanent resident to apply for this position.)

Summary:

The internship will initially focus on supporting through-Si Via (TSV) integration process enhancements, including, but not limited to TSV liners, barrier layers, metallization, and plating. Future focus for this position may include thin film deposition and wafer processing for novel MEMS-like device structures. This position will support internally and externally funded development projects.

Essential Duties & Responsibilities:

• Hands-on engineering resource for integration process enhancements.
• Participate and conduct process improvement experiments, accurately recording and reporting data
• Employ standard troubleshooting protocols

For more information and to apply, please see the job posting.