On June 17-21, 2019, Duke University’s Software-Tailored Architectures for Quantum Codesign (STAQ) will host the Quantum Ideas Summer School. This event will cover topics including quantum computation, algorithms for near-term devices, and quantum error correction as well as hardware tutorials.
Lectures are scheduled from several quantum experts:
- Ken Brown (Duke University)
- Fred Chong (University of Chicago)
- Jungsang Kim (Duke University)
- Peter Love (Tufts University)
- Iman Marvian (Duke University)
- Akimasa Miyaka (University of New Mexico)
- Hanhee Paik (IBM)
The program is open to undergraduates. graduate students, and industry professionals. The application deadline is March 15, 2019. Please see the program website for more information and application instructions.
Head out to Durham, NC this month to visit the Museum of Life and Science! This month nano will be featured in multiple ways. The Nano exhibit introduces the basics of nanoscience and its real-world applications.
The show “Nanostructures: Nature vs Engineering” features images of nanoscale structures from RTNN faculty member Dr. Chih-Hao Chang, associate professor of Mechanical and Aerospace Engineering at NC State University.
The Lab has hands-on nano-activities. Each week new topics will be featured. Join us in The Lab on Saturday, March 2nd to test drive our new desktop SEM.
Nanoengineering: Tiny Things
February 5 – 10
Nano and Nature: Animals
February 12 – 17
Nano and Nature: Plants
February 29 – 24
Nano and You
February 26 – March 3
And, every Saturday, local nano-scientists and -engineers will be in The Lab to uncover how nanotechnologies are made, studied, and used.
For more information, visit the Museum’s Nanomonth website.
The RTNN ambassadors program is now accepting applications for the spring semester. This program is open to undergraduate and graduate students from NC State University, Duke University, and the University of North Carolina at Chapel Hill. Program participants will give facility tours to university guests, host student groups in the facilities, travel to local schools for outreach events, and more! Ambassadors will also have the opportunity to meet a variety of facility users and guests, network with other RTNN ambassadors, and actively participate in the planning and implementation of RTNN programming and events.
For more information about ambassador responsibilities and application instructions please visit the program website. Priority applications are due February 18, 2019.
“Science Outside the Lab” brings a small cohort of graduate student scientists and engineers to Washington, D.C. to explore the relationships among science, innovation, policy, and societal outcomes. This customized free one week version (June 2 – 8, 2019), sponsored by the Nanotechnology Collaborative Infrastructure Southwest (NCI-SW), will investigate the context of nanotechnology decision-making in government and business at the local, state, federal, and international levels. During the week-long workshop participants meet and interact with groups of people who fund, regulate, shape, critique, publicize, and study nanotechnology and other emerging technologies. This includes people like congressional staffers, lobbyists, funding agency officers, regulators, journalists, academics, museum curators, and others.
To apply to the program, complete this application and email as an attachment to Andra Williams at email@example.com or fax to (480-727-8791). Application deadline: March 1, 2019.
For more information, please see the program flier. Contact Andra Williams with any questions.
Micross AIT is looking to immediately hire an MS or PhD candidate student with thin film deposition and/or wafer processing experience for a 6 month internship, ideally 20-25 hrs/week. The work schedule is flexible so the student can honor his/her commitments for obtaining his/her degree. The current position is funded from January – June 2019, with an option to extend through the end of the summer. (Please note, student must be a US citizen or permanent resident to apply for this position.)
The internship will initially focus on supporting through-Si Via (TSV) integration process enhancements, including, but not limited to TSV liners, barrier layers, metallization, and plating. Future focus for this position may include thin film deposition and wafer processing for novel MEMS-like device structures. This position will support internally and externally funded development projects.
Essential Duties & Responsibilities:
- Hands-on engineering resource for integration process enhancements.
- Participate and conduct process improvement experiments, accurately recording and reporting data
- Employ standard troubleshooting protocols
For more information and to apply, please see the job posting.